About SiC Schottky diodes

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Diamond wire multi-wire cutting is utilised to manage warp, bow, and TTV; double-sided grinding is used to remove the reducing problems layer and lift warp, bow, TTV and LTV; double-sided polishing is utilized to lessen the roughness fewer than 2nm. IGBTs can give decrease ON resistances than MOSFETs by conductivity https://sic-schottky-barrier-diod02345.ja-blog.com/18406977/sic-diode-manufacturers-usa-an-overview


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